Title:
電子部品冷却装置
Document Type and Number:
Japanese Patent JP5386564
Kind Code:
B2
More Like This:
| JP4902003 | Electronics |
| JPH0555557 | [Name of invention] Heat sink structure |
Inventors:
Tomoaki Ikeda
Miyazawa Masatsugu
Masayuki Iijima
Koji Ueno
Paul Jay Gwin
Brian Jay Long
Peter A. Davison
Rolf A. Constad
Miyazawa Masatsugu
Masayuki Iijima
Koji Ueno
Paul Jay Gwin
Brian Jay Long
Peter A. Davison
Rolf A. Constad
Application Number:
JP2011213166A
Publication Date:
January 15, 2014
Filing Date:
September 28, 2011
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
Intel Corporation
Intel Corporation
International Classes:
H01L23/467; H01L23/473; H05K7/20
Domestic Patent References:
| JP57045755U | ||||
| JP59025743U | ||||
| JP2002094277A |
Foreign References:
| US3817321 | ||||
| US20030201092 |
Attorney, Agent or Firm:
西浦 ▲嗣▼晴