To provide an electronic part device having superior reliability upon long term connection, capable of connecting a semiconductor chip to a package substrate by a built-up multilayered wiring board.
This electronic component device is abuttingly mounted on a connecting electrode terminal formed, corresponding to the connecting electrode of the electronic component on a specific region of a wiring on the surface of a package substrate, so as to correspond to the connecting electrode of the electronic component for the electrical connection of the connecting electrode terminal to the connecting electrode of the electronic component. At this time, the package substrate is to be a resin compound base multilayered wiring board, having a conductor made hole electrically connecting multiple insulating layers, the surface wiring layer including the connecting electrode terminal, the wiring layer, excluding the surface wiring arranged through the intermediary of the respective insulating layers, the specific inter-wiring layers and the surface wiring having the connecting terminal. Furthermore, in the insulating resin comprising the outermost insulating layer on the connecting side of the electronic component, the stored elastic modulus at the temperature in the package time of the electronic component is specified to exceed 1 GPa.
URASAKI NAOYUKI
SHIMADA YASUSHI
NAKASO AKISHI
WATANABE ITSUO
TAKEMURA KENZO
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