ELECTRONIC COMPONENT HOLDING JIG, HOLDING METHOD OF ELECTRONIC COMPONENT HOLDING JIG AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Title:

ELECTRONIC COMPONENT HOLDING JIG, HOLDING METHOD OF ELECTRONIC COMPONENT HOLDING JIG AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Document Type and Number:

Japanese Patent JP3508649

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an electronic component holding jig, the holding method of the electronic component holding jig and the manufacturing method of an electronic component, which raise the productivity of the electronic component and the reliability of the electronic component and enable a reduction in the manufacturing cost of the component.
SOLUTION: An elastic material 2 with at least the surface part to show an adhesion and a conductivity is provided on the upper part of a plate 1 to make substrates 3, which are the constituent components of an electronic component, adhesion-hold on the surface of the material 2 and elements 4, such as semiconductor chips, are mounted on the prescribed positions on the substrates 3 respectively.

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Inventors:

Katsube, Akio
Nakakoshi, Hideo

Application Number:

JP29157699A

Publication Date:

March 22, 2004

Filing Date:

October 13, 1999

Export Citation:

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Assignee:

MURATA MFG CO LTD

International Classes:

H01L21/683; H01L21/60; H01L21/68; (IPC1-7): H01L21/60; H01L21/68

Attorney, Agent or Firm:

小森久夫

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