Title:
電子部品およびその製造方法
Document Type and Number:
Japanese Patent JP7140530
Kind Code:
B2
Abstract:
To provide an electronic component which can achieve downsizing, and to provide a manufacturing method of the electronic component.SOLUTION: An electronic component 1 includes: an interposer 2 having a first main surface 3 and a second main surface 4; a chip 21 which has a mounting surface 23 and a non-mounting surface 24 and is disposed on the first main surface 3 of the interposer 2 in a posture in which the mounting surface 23 faces the first main surface 3 of the interposer 2; a sealing insulation layer 41 which seals the chip 21 on the first main surface 3 of the interposer 2 so as to expose the non-mounting surface 24 of the chip 21; and a cover layer 46 which covers the non-mounting surface 24 of the chip 21 on the sealing insulation layer 41.SELECTED DRAWING: Figure 3
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Inventors:
▲柳▼田 秀彰
Application Number:
JP2018074077A
Publication Date:
September 21, 2022
Filing Date:
April 06, 2018
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/12; H01L23/14; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2017201659A | ||||
| JP2011134821A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office