Title:
電子部品製造装置およびその製造方法
Document Type and Number:
Japanese Patent JP5510222
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component manufacturing device capable of surely applying electrode paste to an element with a fixed film thickness, without receiving influence of a change of viscosity with the passage of time.SOLUTION: The electronic component manufacturing device is to form a coated film on a coated film forming surface by keeping a space between the coated film forming surface and the tip of a blade, and scraping off electrode paste when supplying the electrode paste, and also comprises a sensor to measure the thickness of the coated film. Since a coated film forming condition for immersing the element can be determined by the relation between a blade clearance being the space between the coated film forming surface and the tip of the blade and the measured thickness of the coated film, the film thickness can be uniformly formed without depending on the change of viscosity with the passage of time, and an electronic component having a desired external electrode can be manufactured.
Inventors:
Katsunori Ogata
Tomoki Shintara
Tomoki Shintara
Application Number:
JP2010205297A
Publication Date:
June 04, 2014
Filing Date:
September 14, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00; H01G4/12; H01G4/30
Domestic Patent References:
| JP7161592A | ||||
| JP2004128168A | ||||
| JP2138794A | ||||
| JP2005050805A | ||||
| JP2007035970A | ||||
| JP63045813A |
Foreign References:
| WO2007007455A1 |
Attorney, Agent or Firm:
Masahiro Okada