Title:
電子部品の製造装置
Document Type and Number:
Japanese Patent JP6787620
Kind Code:
B2
Abstract:
An electronic component manufacturing method includes a blotting process of bringing a conductive paste 4 applied to an end portion of each electronic component body 1 held by a jig into contact with a surface 101 of a surface plate 100. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face 2A of each electronic component body 1 and the surface 101 of the surface plate 100 and a position changing process of changing a two-dimensional position where the end face 2A of the electronic component body 1 is projected on the surface 101 of the surface plate 100 in such a manner that the direction of the movement of two-dimensional position in parallel to the surface 101 of the surface plate 100 successively varies (e.g., along a circular path).
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Inventors:
Hideko Sato
Hitoshi Sakamoto
Hitoshi Sakamoto
Application Number:
JP2020524263A
Publication Date:
November 18, 2020
Filing Date:
July 10, 2019
Export Citation:
Assignee:
Creative Coatings Co., Ltd.
International Classes:
H01G4/30; H01C17/28; H01F41/04; H01G13/00
Domestic Patent References:
| JP2016100459A | ||||
| JP5182879A | ||||
| JP4291712A | ||||
| JP2009164190A | ||||
| JP2016082209A | ||||
| JP4263414A | ||||
| JP3267170A | ||||
| JP59087073A | ||||
| JP2016137437A |
Foreign References:
| WO2018070093A1 |
Attorney, Agent or Firm:
Inoue Ichi
Takekoshi Noboru
Yasushi Kuroda
Takekoshi Noboru
Yasushi Kuroda