Title:
ELECTRONIC COMPONENT MANUFACTURING METHOD AND ELECTRONIC COMPONENT MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2023142457
Kind Code:
A
Abstract:
To provide an electronic component manufacturing method and an electronic component manufacturing device that form an external electrode with a flat surface and a desired shape.SOLUTION: An electronic component manufacturing method includes the step of: applying a conductive paste to an external electrode formation region; bringing the conductive paste applied to the external electrode formation region into contact with a liquid repellent layer containing at least one of liquid that is liquid repellent to a solvent contained in the conductive paste and a solid that is solidified liquid; stopping the conductive paste in contact with the liquid repellent layer; and separating a main body portion from the liquid repellent layer. A manufacturing device 100 includes: a holder 20 that holds a main body portion applied with a conductive paste in an external electrode forming region; a surface plate 30 for forming, on the holder, a liquid repellent layer containing at least one of liquid that is liquid repellent to a solvent contained in the conductive paste and a solid that is solidified liquid; and a moving mechanism 40 capable of moving the holder in order to bring the applied conductive paste into contact with the liquid repellent layer formed on the surface plate.SELECTED DRAWING: Figure 5
Inventors:
YAMAMOTO TAKESHI
Application Number:
JP2022049381A
Publication Date:
October 05, 2023
Filing Date:
March 25, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/30; H01G13/00
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
Takahiro Nosue
Hitoshi Nishizawa
Takahiro Nosue
Hitoshi Nishizawa