Title:
電子部品の製造方法および電子部品製造装置
Document Type and Number:
Japanese Patent JP7180555
Kind Code:
B2
Abstract:
The present invention provides an electronic component manufacturing apparatus capable of manufacturing a high-quality green sheet laminate in which green sheets are heat-crimped to each other with a high bonding force. The electronic component manufacturing apparatus includes: a cutting mechanism configured to cut a conveyed green sheet; a crimping roller having a heat source disposed therein and a plurality of vent holes disposed on the outer peripheral surface thereof, the crimping roller being capable of changing the outer peripheral surface to any of a suction state, an exhaust state, and an atmosphere open state; and a laminating table which is provided with a heat source and moves in the horizontal direction.
Inventors:
Kato Masarei
Kazuhiro Tabata
Minoru Dooka
Tsunemasa Irie
Kazuhiro Mikami
Kazuhiro Tabata
Minoru Dooka
Tsunemasa Irie
Kazuhiro Mikami
Application Number:
JP2019124080A
Publication Date:
November 30, 2022
Filing Date:
July 02, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30; H01G13/00
Domestic Patent References:
| JP3297117A | ||||
| JP2000246718A |
Foreign References:
| WO2018021439A1 | ||||
| WO2019008876A1 |
Attorney, Agent or Firm:
Takashi Kawamoto
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