Title:
電子部品の製造方法及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP7120521
Kind Code:
B2
Abstract:
A method of manufacturing an electronic component having an electrode at an end portion thereof is disclosed. The method includes placing a jig on a heater block, wherein the jig includes a path inclined with respect to a pedestal including a placement surface and extending toward the pedestal; placing an electronic component main body having the electrode on the placement surface with the electrode facing the path; rolling a ball-shaped solder in the path to reach the electrode; and melting the solder through the pedestal to attach the molten solder to the electrode.
Inventors:
Yasuyuki Yamauchi
Application Number:
JP2018240762A
Publication Date:
August 17, 2022
Filing Date:
December 25, 2018
Export Citation:
Assignee:
Sumitomo Electric Device Innovation Co., Ltd.
International Classes:
H01L21/60; B23K3/06; H01L25/00; H05K3/34
Domestic Patent References:
| JP2001230540A | ||||
| JP4127660U |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
▲高▼木 邦夫
Shotaro Terazawa
Yoshiki Kuroki
▲高▼木 邦夫
Shotaro Terazawa