Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP7283221
Kind Code:
B2
Abstract:
To suppress occurrence of leakage of an internal electrode when cutting an un-calcined mother laminate, with a cutting blade.SOLUTION: A plate-like cutting blade 10 comprises a thick wall part 1 positioned on one side in a width direction G, and a cutting part 2 positioned on the other side in the width direction G and smaller in dimension in a thickness direction E than the thick wall part 1. When viewed in a length direction F, an angle θ1 formed at a tip part of the cutting part 2 is 20° or more and 25° or less. The cutting part 2 has a shape whose dimensions in the thickness direction E gradually becoming smaller in at lest two stages from a boundary between the part and thick wall part 1 toward the tip thereof so as to form a sharp angle with a virtual line drawn in parallel to a main surface when viewed in the length direction F. When a portion including the tip of the cutting part 2 is defined as a first cutting portion 21 and a portion adjacent to the first cutting portion 21 is defined as a second cutting portion 22, a distance H1 from the tip to the boundary between the first cutting portion 21 and the second cutting portion 22 in the width direction G is 60 μm or more and 90 μm or less.SELECTED DRAWING: Figure 1
Inventors:
Shimazaki Shun
Application Number:
JP2019092759A
Publication Date:
May 30, 2023
Filing Date:
May 16, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B26D1/06; B26D3/00; H01G4/30; H01G13/00
Domestic Patent References:
| JP2012071374A | ||||
| JP2017157754A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
Hitoshi Nishizawa
Takahiro Nosue
Hitoshi Nishizawa
Takahiro Nosue
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