Title:
電子部品モジュール
Document Type and Number:
Japanese Patent JP7111514
Kind Code:
B2
Abstract:
An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.
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Inventors:
Taiji Ito
Application Number:
JP2018110517A
Publication Date:
August 02, 2022
Filing Date:
June 08, 2018
Export Citation:
Assignee:
Kaga FEI Co., Ltd.
International Classes:
H01L25/00; H01L23/00; H01L23/28; H05K9/00
Domestic Patent References:
| JP2009099818A | ||||
| JP2009033114A | ||||
| JP2004159287A | ||||
| JP2012182274A |
Foreign References:
| US20030128526 |
Attorney, Agent or Firm:
Shuhei Katayama
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