Title:
電子部品装着装置
Document Type and Number:
Japanese Patent JP4119683
Kind Code:
B2
Inventors:
Kazuyoshi Oyama
Shuji Main Mountain
Hidekazu Yamanaka
Shigeru Kageyama
Takahiro Nagata
Yoshiyuki Kumakura
Kazuyoshi Iizumi
Shuji Main Mountain
Hidekazu Yamanaka
Shigeru Kageyama
Takahiro Nagata
Yoshiyuki Kumakura
Kazuyoshi Iizumi
Application Number:
JP2002143372A
Publication Date:
July 16, 2008
Filing Date:
May 17, 2002
Export Citation:
Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
| JP3131705A | ||||
| JP7142895A | ||||
| JP9270595A |
Attorney, Agent or Firm:
Kiyotaka Aizawa