Title:
Electronic component mounting device
Document Type and Number:
Japanese Patent JP6293454
Kind Code:
B2
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Inventors:
Komaike Kunimune
Hideyuki Kamasuka
Osamu Kanai
Hideyuki Kamasuka
Osamu Kanai
Application Number:
JP2013230213A
Publication Date:
March 14, 2018
Filing Date:
November 06, 2013
Export Citation:
Assignee:
YAMAHA HATSUDOKI KABUSHIKI KAISHA
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
JP2009004400A | ||||
JP2008098411A | ||||
JP2008070135A | ||||
JP2006222465A | ||||
JP2012248626A | ||||
JP2011216616A |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Haruhiro Hirata
Masataka Otani
Haruhiro Hirata
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