電子部品の実装装置

Japanese Patent JP7451259

B2

The present invention provides an electronic component mounting device which can perform mounting while suppressing the influence of generated dust. The electronic component mounting device according to an embodiment includes: a mounting mechanism configured to hold a mounting head of an electronic component at a mounting position to mount the electronic component onto a substrate; a substrate support mechanism configured to support the substrate for mounting the electronic component; a supply part configured to supply the electronic component; and a transfer part configured to transfer the electronic component from the supply part to the mounting position. The transfer part includes: a transfer head, which picks up the electronic component from an electronic component placement surface of the supply part to pass it to the mounting head; an arm part provided with the transfer head at one end; and a transfer mechanism which has a sliding part provided at a position that does not overlap with the placement surface in a plan view, and uses the sliding of the sliding part to drive the arm part to move the transfer head between the supply part and the mounting position.

JP3499752

SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Masanori Hashimoto

JP2020056461A

March 18, 2024

March 26, 2020

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Shibaura Mechatronics Co., Ltd.

H01L21/60; H05K13/04

JP2004128384A
JP2013102016A
JP2015204349A
JP2013065802A
JP2008522417A
JP2008085322A
JP5198623A
JP2013055207A
JP2003318228A
JP2003297880A

Mitsuharu Kiuchi
Koichi Okuma
Sadanori Katagiri
Kanako Kiuchi

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