To provide an electronic component mounting structure wherein a space for isolating a heating component is formed with a simple structure, and the amount of resin for filling the space can be reduced without deteriorating the heat dissipating property of the heating component.
The electronic component mounting structure is provided with a printed board 2 for mounting electronic components 1a on both surfaces, a case main body 3 for accommodating the printed boards 2 and a case lid 4 for covering the case main body 3. A partition plate 5 for partitioning a space in the case is installed in at least either one of the case main body 3 and the case lid 4. The partitioned spaces communicate with each other, and an electronic component 1b needing heat dissipation is arranged in the partitioned space, which is filled with resin 6.
| JP2015002246 | MOLD PACKAGE |
| WO/2024/057729 | ELECTRONIC DEVICE AND IMAGING APPARATUS |
YAMASHITA KOJI
FUKUDA KENICHI
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