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Patent Searching and Data


Title:
電子部品ユニット、その製造方法および実装部材
Document Type and Number:
Japanese Patent JP7388098
Kind Code:
B2
Abstract:
To enhance the stability of mechanical and electrical connections of an electronic component to a substrate or the like.SOLUTION: An electronic component unit (2) includes a holder (6) and a packaging member (8). The holder retains an electronic component (4). The packaging member includes a terminal connection part (40) connected with an electronic component, a plurality of fixing pins (42) used to be fixed onto a substrate and a conductor connection part (38) connecting the terminal connection part with the plurality of fixing pins. The conductor connection part can be divided into a central part (38-1) and a side part (38-2) sandwiching the central part, and the terminal connection part is arranged at the central part of the conductor connection part and each of the plurality of fixing pins is arranged at the side part of the conductor connection part.SELECTED DRAWING: Figure 1

Inventors:
Mitsuru Kurosu
Osamu Ichikura
Application Number:
JP2019177869A
Publication Date:
November 29, 2023
Filing Date:
September 27, 2019
Export Citation:
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Assignee:
Nippon Chemi-Con Corporation
International Classes:
H01G2/02; H01G2/06; H01G9/00; H01G9/048; H01G9/10; H05K7/12
Domestic Patent References:
JP2017208409A
JP2008124244A
JP2006100658A
Foreign References:
WO2018020993A1
Attorney, Agent or Firm:
Masakazu Unemoto
Tsugitate Uemoto
Takuya Uemoto
Masaki Okita