Title:
電子部品、フィルタおよびマルチプレクサ
Document Type and Number:
Japanese Patent JP7406341
Kind Code:
B2
Abstract:
To suppress degradation in airtightness.SOLUTION: An electronic component comprises: a first substrate 10; a second substrate 20 which is disposed above the first substrate in a manner facing the first substrate across a gap 26; a first metal layer 32a which is provided on the first substrate in a manner surrounding the second substrate in plan view of the first substrate; a second metal layer 32b which is provided on the first substrate in a manner surrounding the second substrate and the first metal layer, while being spaced apart from the first metal layer; an element provided on a surface on the first substrate side of the second substrate; and a sealing part 30 which surrounds the second substrate and seals the element, and which is provided above the first metal layer and the second metal layer while covering a portion between the first metal layer and the second metal layer.SELECTED DRAWING: Figure 1
Inventors:
Hajime Yamauchi
Application Number:
JP2019192060A
Publication Date:
December 27, 2023
Filing Date:
October 21, 2019
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H03H9/25; H01L23/02; H03H9/02; H03H9/17
Domestic Patent References:
| JP2019047349A | ||||
| JP2005167969A | ||||
| JP2008288497A | ||||
| JP2012034302A | ||||
| JP2017204544A |
Attorney, Agent or Firm:
Shuhei Katayama
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