Title:
ELECTRONIC COMPONENT AND POWER SUPPLY MODULE
Document Type and Number:
Japanese Patent JP2023013015
Kind Code:
A
Abstract:
To provide an electronic component capable of reducing the mounting area of a circuit board and exhibiting excellent heat dissipation.SOLUTION: An electronic component (30) includes a laminate (31) including an internal electrode layer (311 and 312) and a dielectric layer (313), a central conductor (32), a peripheral conductor (33), a resistive layer (34) and an external electrode layer (35). One internal electrode layer (311) includes a central electrode (311a); the other internal electrode layer (312) includes a peripheral electrode (312b); the inner peripheral part of the peripheral electrode (312b) overlaps with the outer peripheral part of the central electrode (311a) so as to sandwich the dielectric layer (313); the central conductor (32) penetrates the central electrode (311a) and the dielectric layer (313); the peripheral conductor (33) penetrates the dielectric layer (313) and the peripheral electrode (312b); the resistive layer (34) is formed in the outer peripheral part of the laminate (31); and the external electrode layer (35) is formed on the outer surface of the resistive layer (34).SELECTED DRAWING: Figure 2
Inventors:
NAKAGAWA TAKUYA
KISHIMOTO KOHEI
SUGIYAMA TOMOHIKO
YOSHINAKA TATSUYA
KISHIMOTO KOHEI
SUGIYAMA TOMOHIKO
YOSHINAKA TATSUYA
Application Number:
JP2021116886A
Publication Date:
January 26, 2023
Filing Date:
July 15, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/40; H01G4/30; H02M7/48
Attorney, Agent or Firm:
Ascend Patent Attorneys Corporation