Title:
電子部品及びその製造方法
Document Type and Number:
Japanese Patent JP5234521
Kind Code:
B2
Abstract:
The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor 1, has: a circuit element 5a formed on a substrate 2; an electrode layer 5b connected to the circuit element 5a; passivation layers 6 and 8 that cover the electrode layer 5b; and terminal electrodes 9a and 9b connected to the electrode layer 5b via via-conductors Va and Vb formed through the passivation layers 6 and 8, the terminal electrodes 9a and 9b being formed to cover the side wall of the passivation layers 6 and 8. Since the pad electrodes 9a and 9b are formed so as to cover the passivation layers 6 and 8 across their uppermost surfaces and side walls, the area of contact between the pad electrodes 9a and 9b and the solder for solder-mounting increases, and the capacitor 1 can consequently exhibit an improved adhesion strength.
Inventors:
Takafumi Otsuka
Choi Kyokyu
Tatsuo Namikawa
Hitoshi Yamaguchi
Choi Kyokyu
Tatsuo Namikawa
Hitoshi Yamaguchi
Application Number:
JP2009192589A
Publication Date:
July 10, 2013
Filing Date:
August 21, 2009
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01G4/12; H01C1/148; H01C17/28; H01F27/29; H01F41/10
Domestic Patent References:
| JP2009164274A | ||||
| JP2007081325A | ||||
| JP2008004734A | ||||
| JP2008251974A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Takuji Fukasawa
Toshifumi Onuki
Takuji Fukasawa