Title:
電子部品
Document Type and Number:
Japanese Patent JP5497504
Kind Code:
B2
Abstract:
The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.
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Inventors:
Takuya Aoyagi
Takashi Naito
Yuji Hashiba
Yoshimura Kei
Shinichi Tachizono
Takashi Naito
Yuji Hashiba
Yoshimura Kei
Shinichi Tachizono
Application Number:
JP2010065579A
Publication Date:
May 21, 2014
Filing Date:
March 23, 2010
Export Citation:
Assignee:
株式会社日立製作所
日立粉末冶金株式会社
日立粉末冶金株式会社
International Classes:
H01B5/00; H01B1/22; H01J9/02; H01J11/12; H01J11/22; H01L31/04; H05K1/09
Domestic Patent References:
| JP2009209032A | ||||
| JP7073731A | ||||
| JP2010184852A | ||||
| JP7058369A |
Foreign References:
| WO2010109905A1 |
Attorney, Agent or Firm:
Isono Dozo
Etsuo Tada
Etsuo Tada