Title:
電子部品
Document Type and Number:
Japanese Patent JP6963448
Kind Code:
B2
Abstract:
An electronic component includes: four device chips having rectangular planar shapes and arranged on a substrate so that a corner of four corners constituting a rectangle of one device chip is adjacent to the corners of remaining three device chips; first pads located on surfaces of the four device chips and closest to the corner; one or more first bumps bonding the first pads to the substrate in the four device chips; second pads located on surfaces of the four device chips, the second pad being one of pads other than the first pad; and one or more second bumps bonding the second pads to the substrate in the four device chips, a sum of bonded areas between the one or more second bumps and the second pad being less than a sum of bonded areas between the first pad and the one or more first bumps.
Inventors:
Motoi Yamauchi
Endo Yuuki
Endo Yuuki
Application Number:
JP2017176140A
Publication Date:
November 10, 2021
Filing Date:
September 13, 2017
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01L23/12; H03H9/17; H03H9/25; H03H9/64; H05K1/18
Domestic Patent References:
| JP2017098300A | ||||
| JP2008508739A | ||||
| JP2002237549A | ||||
| JP2015002381A |
Attorney, Agent or Firm:
Shuhei Katayama
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