Title:
ELECTRONIC CONTROL UNIT
Document Type and Number:
Japanese Patent JP3807594
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To protect an electronic circuit module from corrosion, vibration and impact and prevent the floating of a bonding wire due to the fluctuation of a gel-like substance functioning as a heat conduction means.
SOLUTION: An electronic control unit comprises an electronic circuit module M mounting different kinds of function elements 2, 3 on a circuit board 1 and a case 4 storing the module. The wiring of the circuit board of the module M and a connector terminal 44 are wire-bonded, and the gel-like substance protecting the module is filled into the case. The gel-like substance is exposed to the arc-like top part 51 of a bonding wire 5, filled downward of the top part, and the influence due to viscous elastic fluctuation of the gel-like substance is not received on the bonding wire.
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Inventors:
Hiroki Takada
Naoto Ogasawara
Toshio Nagata
Naoto Ogasawara
Toshio Nagata
Application Number:
JP2000230301A
Publication Date:
August 09, 2006
Filing Date:
July 31, 2000
Export Citation:
Assignee:
Aisin AW Co., Ltd.
Kyocera Corporation
Kyocera Corporation
International Classes:
H01L23/28; H01L25/04; H01L25/18; (IPC1-7): H01L23/28; H01L25/04; H01L25/18; H01R12/04
Domestic Patent References:
| JP57193236U | ||||
| JP8204048A |
Attorney, Agent or Firm:
Makoto Kawai
Mamoru Shimizu
Toshiaki Aoki
Mamoru Shimizu
Toshiaki Aoki
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