PURPOSE: To prevent the temperature of an FMT chip from rising and to improve a cooling efficiency by setting up an electronic cooling device to cool a ceramic substrate directly.
CONSTITUTION: An electrnic cooling device 25 in a triple module construction using a Peltier effect cools directly the back of a ceramic substrate 28 and diffuses heat taken throughout a case 27 through a radiating fin 26. As the ceramic substrate 28 with an amplification circuit 21 on it is directly cooled by the thermoelectric device 25, a heat capacity and a substrate area of a cooling part can be made far smaller than those of a conventional device. Heat flowing into a cooling part through an in-out terminal from the outside is shutoff by the ceramic substrate 28. Consequently a cooling capacity can be improved sharply. A much better effect can be obtained by mounting an FET chip on a mounting part, in which such a metal plate as copper is embedded, of an FET chip 29 of the ceramic substrate 28.
ARAI MEGUMI
HAMABE TSUYOSHI
SAITOU TOSHIYUKI
