Title:
電子デバイス、電荷輸送性膜、及び、アミン化合物
Document Type and Number:
Japanese Patent JP7327028
Kind Code:
B2
Abstract:
To provide an electronic device with excellent heat resistance.SOLUTION: In an electronic device, an organic compound layer includes a cured product obtained by at least curing an amine compound represented by the formula (1-1).SELECTED DRAWING: Figure 1
Inventors:
Kei Sugawara
Eiichi Hirose
Tomoya Sasaki
Eiichi Hirose
Tomoya Sasaki
Application Number:
JP2019168990A
Publication Date:
August 16, 2023
Filing Date:
September 18, 2019
Export Citation:
Assignee:
FUJIFILM Business Innovation Co., Ltd.
International Classes:
H10K85/60; C07D209/86; C07D403/14; C07D471/04; G03G5/047; G03G5/05; G03G5/06; G03G5/07; H10K50/15
Domestic Patent References:
| JP2008244471A | ||||
| JP2019009156A | ||||
| JP2019129182A | ||||
| JP2013060422A | ||||
| JP2006302556A | ||||
| JP2013043841A |
Foreign References:
| KR1020190031734A | ||||
| WO2009133753A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office