To provide a method of manufacturing a semiconductor device by which a terminal of an electronic component is mounted on an electrode pad of a circuit board with certainty without increase in size of the electrode pad of the circuit board.
A method of manufacturing an electronic device includes: a step of making a first terminal 120a of an electronic component contact with a first electrode 223a formed on a circuit board 200 and making a first drag F1a parallel to a mounting surface of the circuit board operate to the first terminal when pressed by the first terminal, and of making a second terminal 120b of the electronic component contact with a second electrode 223b formed on the circuit board and making a second drag F1b for canceling the first drag operate to the second terminal when pressed by the second terminal; and a step of pressing the first and second terminals to the first and second electrodes.
TAKEUCHI SHUICHI
SATO YOSHIYUKI
KOYAE KENJI
