To provide a manufacturing method of an electronic device for manufacturing a reliable electronic device with high productivity, and the electronic device manufactured by the method.
An integrated circuit 1 includes a two-layered bonding pad 8 connected with a conductive wire 5 via a contact hole 10. The bonding bad 8 includes a surface layer 7 joining with a bonding wire 9, and a foundation layer 6 for improving adhesion between the surface layer 7 and a cover layer 4. The foundation layer 6 and the surface layer 7 are formed using Au dispersion liquid containing fine Au particles by a drop discharging method. The adhesion between the foundation layer 6 and the cover layer 4 is applied by counter-diffusion between Au and Si on their interface.
Fujitsuna Hideyoshi
Osamu Suzawa