ELECTRONIC DEVICE MANUFACTURING METHOD

Japanese Patent JP2015023127

A

PROBLEM TO BE SOLVED: To provide an electronic device manufacturing method, with which it is possible to improve peelability between a stamp and a lamination film without providing a peeling film that is used in a conventional technique and is transferred together with the lamination film.SOLUTION: A stamp adjacent metal film 7 and a substrate side bonding metal film 3 are formed using the same metal material (Au), with the stamp adjacent metal film 7 being formed to have a hardness lower than that of the substrate side bonding metal film 3. The stamp adjacent metal film 7 is formed to have the low hardness, so that it is possible to improve peelability between a stamp 4 and the stamp adjacent metal film 7 or the like(lamination film 15) and increase a transfer rate. Therefore, it is possible to improve the peelability of the stamp adjacent metal film 7 or the like without providing a peeling film that is used in a conventional technique and is transferred together with the stamp adjacent metal film 7 or the like. Also, such a transferred peeling film is not provided, so that it is possible to form a structure, such as a resist film 35, on the stamp adjacent metal film 7 under a state of being transferred, which simplifies a manufacturing process.

MORITA SATOSHI
ADACHI SUSUMU
WADA YUKIHISA
KAINO MASATOMO
FURUI SHINGO

JP2013149506A

February 02, 2015

July 18, 2013

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SHIMADZU CORP

H01L21/336; H01L21/02; H01L21/283; H01L21/285; H01L27/12; H01L29/786

Tsutomu Sugitani
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Important point

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