Title:
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016054040
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To join an electrode of a circuit board and a metal terminal of an electronic component with ultrasonic wave.SOLUTION: A space part with a through hole right below an electrode 5 is made to be a bottomed hole having the electrode 5 as a bottom without filling the space part with the electrode 5, an anvil 30 is inserted thereto to directly fix the lower surface of the electrode 5 with the upper end surface of the anvil 30. When an ultrasonic joining head 1 is driven while pressing the junction interface between a lead terminal 10 and the electrode 5 with an ultrasonic horn 15 and the anvil 30, the amplitude loss is suppressed and the lead terminal 10 and the electrode 5 are joined with ultrasonic wave. Consequently, the lead terminal 10 made of aluminum or an aluminum alloy which is difficult to be soldered can be directly joined to the electrode 5 of a circuit board 20.SELECTED DRAWING: Figure 4
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Inventors:
HAYASHI KEIICHIRO
Application Number:
JP2014178868A
Publication Date:
April 14, 2016
Filing Date:
September 03, 2014
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
H01R4/02; H01M2/10; H01M2/30; H01R12/51; H05K3/32
Domestic Patent References:
| JP2002271006A | 2002-09-20 | |||
| JP2014072270A | 2014-04-21 | |||
| JPH07302974A | 1995-11-14 | |||
| JPH05235531A | 1993-09-10 | |||
| JPH06350241A | 1994-12-22 | |||
| JP2008146944A | 2008-06-26 | |||
| JPH11330300A | 1999-11-30 | |||
| JP2013000792A | 2013-01-07 | |||
| JP2002280416A | 2002-09-27 | |||
| JP2002141052A | 2002-05-17 | |||
| JP2001007511A | 2001-01-12 |
Foreign References:
| US6123588A | 2000-09-26 |
Attorney, Agent or Firm:
Takashi Kawai
Hitoshi Nakano
Hitoshi Nakano
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