Title:
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2020025002
Kind Code:
A
Abstract:
To provide an electronic device having low thermal resistance between a substrate on which electronic components are mounted and a radiator and having excellent performance and reliability.SOLUTION: An electronic device 1A includes a substrate 20 having an electronic component 30 mounted on a surface 20a, and a radiator 10. A groove 11 is provided on at least one of a back surface 20b of the substrate 20 and a front surface 10a of the radiator 10 opposed thereto, for example, on the front surface 10a of the radiator 10. A gold layer 22 and a gold layer 12 are provided on the back surface 20b of the substrate 20 and the front surface 10a of the radiator 10, respectively, and the gold layers are directly bonded by gold-gold bonding. In the groove 11, a thermal conductor 40 is provided so that a cavity exists in the groove.SELECTED DRAWING: Figure 2
Inventors:
SATO MOTONOBU
Application Number:
JP2018148288A
Publication Date:
February 13, 2020
Filing Date:
August 07, 2018
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/40; B23K20/00; H01L21/52; H01L23/12
Attorney, Agent or Firm:
Takeshi Hattori