Title:
電子素子実装用基板、電子装置、および電子モジュール
Document Type and Number:
Japanese Patent JP7210191
Kind Code:
B2
Abstract:
In one aspect of this disclosure, an electronic device mounting board includes a substrate having a first surface and a second surface opposite to the first surface. The substrate has a first recess located on the first surface and a second recess located on the second surface. The substrate includes an electrode pad. The electrode pad is located in the first recess. The second recess in the substrate contains a reinforcement dividing the second recess into a plurality of recesses. The reinforcement is located separate from the electrode pad or is located to overlap the electrode pad in a plan view.
Inventors:
Takeshita text
Akiaki Nonoyama
Akiaki Nonoyama
Application Number:
JP2018161274A
Publication Date:
January 23, 2023
Filing Date:
August 30, 2018
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/46; H01L23/12; H01L23/13; H01L23/28
Domestic Patent References:
| JP2016207958A | ||||
| JP2014116640A | ||||
| JP2007059863A | ||||
| JP6302709A | ||||
| JP2006073763A | ||||
| JP2015159153A | ||||
| JP6112633A | ||||
| JP2007251192A | ||||
| JP2008177506A | ||||
| JP2017034138A | ||||
| JP2016063046A | ||||
| JP2016207957A | ||||
| JP2015141953A |
Foreign References:
| WO2014203603A1 | ||||
| WO2016189609A1 |
Attorney, Agent or Firm:
Nishikyo Keiichiro
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