Title:
電子素子実装用基板、電子装置、電子モジュールおよび電子素子実装用基板の製造方法
Document Type and Number:
Japanese Patent JP7212783
Kind Code:
B2
Abstract:
An electronic element mounting substrate includes a first insulating layer, a second insulating layer, a first metal layer, and a through-hole conductor. The first insulating layer and the second insulating layer are aligned in a first direction. The first metal layer is positioned between the first insulating layer and the second insulating layer. The through-hole conductor extends in the first direction from the first insulating layer through the second insulating layer. The first metal layer includes a first portion positioned away from the through-hole conductor and a second portion in contact with the through-hole conductor. The second portion has a larger thickness than the first portion.
Inventors:
Akihiko Funabashi
Application Number:
JP2021535388A
Publication Date:
January 25, 2023
Filing Date:
July 29, 2020
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01L23/02; H05K1/11; H05K3/46
Domestic Patent References:
| JP2009289805A | ||||
| JP2006165355A | ||||
| JP2014033004A | ||||
| JP2017107933A |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK
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