Title:
電子デバイスパッケージ用テープ
Document Type and Number:
Japanese Patent JP7112997
Kind Code:
B2
Abstract:
To provide an electronic device package tape that can reduce the peeling of an adhesive layer from an electronic device when the adhesive layer is cured and can be attached well to a ring frame.SOLUTION: An electronic device package tape according to the present invention includes a long base material tape 2, an aggregate 30 provided on the base material tape 2, and obtained by collecting a plurality of individual pieces and composed of a laminate of an adhesive layer 3 and a metal layer 2, and an adhesive tape 5, and the plurality of individual pieces in the aggregate 30 are arranged along the longitudinal direction of the base material tape 2 to form a column L, and the plurality of individual pieces are arranged along the lateral direction of the base material tape 2 to form a row G, and a plurality of guide members 12 are provided along the column L with a space from each other, and the guide member 12 is arranged such that the space and the gap between the individual pieces in the column L do not overlap at the position in the row G direction.SELECTED DRAWING: Figure 2
Inventors:
Takanori Tsuchiya
Application Number:
JP2019197560A
Publication Date:
August 04, 2022
Filing Date:
October 30, 2019
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L23/36; C09J7/10; C09J7/35; C09J7/38; C09J11/06; C09J11/08; C09J133/00; C09J133/06; C09J163/00; C09J171/10; H01L21/301
Domestic Patent References:
| JP2017183643A | ||||
| JP2018065948A | ||||
| JP2017059648A | ||||
| JP2018127518A | ||||
| JP2020053453A |
Foreign References:
| WO2017168829A1 |
Attorney, Agent or Firm:
Ryo Matsushita
Takako Hashimoto
Takako Hashimoto