Title:
電子デバイスパッケージ用テープ
Document Type and Number:
Japanese Patent JP6775005
Kind Code:
B2
Abstract:
Provided is an electronic device package tape that can inhibit the occurrence of warpage in a layered product of a semiconductor, bonding adhesive layer, and semiconductor chip when precuring the bonding adhesive layer and that can inhibit the formation of voids in the bonding adhesive layer during flip-chip connection. An electronic device package tape of the present invention is characterized by comprising: an adhesive tape that has a base film and a pressure-sensitive adhesive layer; a metal layer that is laminated on the side of the pressure-sensitive adhesive layer opposite the base film; and a bonding adhesive layer that is laminated on the side of the metal layer opposite the pressure-sensitive adhesive layer and is for bonding the metal layer to the rear face of an electronic device. The electronic device package tape is further characterized in that the storage elastic modulus at 25ºC of the bonding adhesive layer after being heated at 100ºC for three hours does not exceed 10 GPa, and the cured proportion of the bonding adhesive layer upon being heated at 100ºC for three hours is 10-100%.
Inventors:
Toru Sano
Jiro Sugiyama
Masami Aoyama
Kunihiko Ishiguro
Jiro Sugiyama
Masami Aoyama
Kunihiko Ishiguro
Application Number:
JP2018508367A
Publication Date:
October 28, 2020
Filing Date:
November 14, 2016
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L23/29; C09J7/20; C09J7/28; C09J7/30; C09J11/04; C09J11/08; C09J133/00; C09J133/08; C09J163/00; C09J171/10; H01L21/301; H01L23/00; H01L23/12; H01L23/31; H01L23/36
Domestic Patent References:
| JP201233626A | ||||
| JP201233555A |
Attorney, Agent or Firm:
Ryo Matsushita
Hashimoto Takako
Hashimoto Takako