Title:
電子デバイスパッケージ用テープ
Document Type and Number:
Japanese Patent JP6852030
Kind Code:
B2
Abstract:
To provide an electronic device packaging tape capable of reducing peel-off of an adhesive layer from an electronic device when a metal layer is bonded to the electronic device via the adhesive layer and the adhesive layer is cured.SOLUTION: An electronic device packaging tape of the present invention includes a long base tape 2, an aggregate 30 formed by assembling a plurality of individual pieces made of a laminate of an adhesive layer 4 and a metal layer 3 provided on the base tape 2, and a pressure-sensitive adhesive tape 5 having a label portion 5a having a predetermined planar shape and provided so as to cover the aggregate 30 and contact the base tape 2 around the aggregate 30. A plurality of individual pieces of the aggregate 30 are disposed along the longitudinal direction of the base tape 2 to form a column L. A plurality of individual pieces are disposed along the lateral direction of the base tape 2 to form a row G. A guide member 12 longer than the column L is provided along the column L.SELECTED DRAWING: Figure 2
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Inventors:
Tsuchiya Takanori
Hiromitsu Maruyama
Hiromitsu Maruyama
Application Number:
JP2018178420A
Publication Date:
March 31, 2021
Filing Date:
September 25, 2018
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/10; C09J7/20; C09J11/04; C09J133/00; C09J133/06; C09J163/00; C09J171/10
Domestic Patent References:
| JP2018127518A | ||||
| JP2017183643A |
Foreign References:
| WO2017168829A1 |
Attorney, Agent or Firm:
Ryo Matsushita
Hashimoto Takako
Hashimoto Takako