Title:
MEMS素子を有する電子デバイス
Document Type and Number:
Japanese Patent JP2009516346
Kind Code:
A
Abstract:
The device ( 100 ) comprises a MEMS element ( 60 ) in a cavity ( 30 ) that is closed by a packaging portion ( 17 ) on a second side ( 2 ) of the substrate ( 10 ). Contact pads ( 25 ) are defined on a flexible resin layer ( 13 ) on an opposite first side ( 1 ) of the substrate. Electrical connections ( 32 ) extend through the resin layer ( 13 ) to at least one element of the device ( 100 ). The device ( 100 ) is suitably made with the use of a temporary carrier ( 42 ), and opening of etching holes ( 18 ) from the second side ( 2 ) of the substrate ( 10 ).
Inventors:
Deckel, Ronald
Paulman, Hauke
Dumlink, Martin
Paulman, Hauke
Dumlink, Martin
Application Number:
JP2008540742A
Publication Date:
April 16, 2009
Filing Date:
November 07, 2006
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
B81C99/00; H01H49/00; B81C1/00; H01H59/00
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito