Title:
ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2002335090
Kind Code:
A
Abstract:
To provide an electronic device capable of securing performance and reliability with no moisture-proof treatment on a circuit board.
Related to an electronic device 1, electronic parts 7a, 7b, and 7c are mounted on a circuit board 5 housed in a case 4. The case 4 is provided with a ventilation pipe 8 which allows communication between the outside and inside of the case 4, with a metal filter 10 provided in the communication pipe 8. A thin metal wire of 0.1-0.5 mm in diameter is intertangled to be flocculent, which is compression-formed to produce the metal filter 10. With the metal filter 10 employed, a vapor in the air coming in from the outside of the case 4 is condensed and captured.
More Like This:
| JPS63214492 | IC CARD |
| WO/2005/060116 | HOUSING ASSEMBLY FOR AN ELECTRONIC DEVICE |
Inventors:
INA OSAMU
KOBAYASHI TOSHIKI
SAWARA FUJIO
ISHIKAWA TOMONORI
KOBAYASHI TOSHIKI
SAWARA FUJIO
ISHIKAWA TOMONORI
Application Number:
JP2001136124A
Publication Date:
November 22, 2002
Filing Date:
May 07, 2001
Export Citation:
Assignee:
DENSO CORP
International Classes:
H05K5/00; H05K5/02; H05K7/20; (IPC1-7): H05K7/20; H05K5/00; H05K5/02
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)
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