ELECTRONIC DEVICE - SEIKO EPSON CORP

Title:

ELECTRONIC DEVICE

Document Type and Number:

Japanese Patent JP2006269492

Kind Code:

A

Abstract:

To improve the corrosion resistance of an electrical connection.

An electronic device includes a first substrate 10 in which a first wiring pattern 12 having a plurality of first terminals 14 is formed, and a second substrate 20 in which a second wiring pattern 22 having a plurality of second terminals 24 is formed. The first and second terminals 14, 24 are overlapped and are connected electrically. The first substrate 10 is formed by resin. A covering layer 40 for covering a region where the plurality of first and second terminals 14, 24 overlap is provided on a surface at a side opposite to the surface in which the first terminal 14 is formed on the first substrate 10. The covering layer 40 has properties for preventing moisture from being permeated as compared with the resin of the first substrate 10.

Inventors:

NISHIOMOTE MUNEHIDE

Application Number:

JP2005081560A

Publication Date:

October 05, 2006

Filing Date:

March 22, 2005

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

H01L21/60

Domestic Patent References:

JP2005338589A	2005-12-08
JP2003195336A	2003-07-09

Attorney, Agent or Firm:

Yukio Fuse
Mitsue Obuchi
Tatsuya Ina
Takekoshi Noboru

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