Title:
ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2015002322
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress defective bonding due to damage on the connection of a connection terminal and a through hole.SOLUTION: A stress relaxation member 90 is arranged on the bottom surface 61 of a case 60, and the material of the stress relaxation member 90 is selected so that the linear coefficient of expansion of the stress relaxation member 90 is closer to that of a substrate 10 than the linear coefficient of expansion of the case 60. Consequently, when the substrate 10 expands or contracts thermally, the stress relaxation member 90 also expands or contracts thermally with a thermal expansion and contraction rate closer to that of the substrate 10. Since a connection terminal 65 is translated perpendicularly to the bottom surface 61 of a case 60 during thermal expansion and contraction, inclination of the connection terminal 65 due to difference in the linear coefficient of expansion between the substrate 10 and case 60 can be prevented. As a result, the stress of a connection member 15 for connecting each connection terminal 65 and a through hole 13 can be relaxed, damage on the connection member 15 is suppressed, and defective bonding can be suppressed.
Inventors:
TAKENAKA MASAYUKI
TATSUMI MASAHIDE
TATSUMI MASAHIDE
Application Number:
JP2013127547A
Publication Date:
January 05, 2015
Filing Date:
June 18, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L25/04; H01L25/18
Domestic Patent References:
| JP2010118160A | 2010-05-27 | |||
| JP2008059776A | 2008-03-13 |
Attorney, Agent or Firm:
Patent business corporation ゆうあい patent firm