蒸発マイクロ冷却を用いる電子装置および関連する方法

Japanese Patent JP2005501392

A

An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump. The electronic device may also include at least one heat exchanger carried by the package and connected in fluid communication with the micro-fluidic cooler. The package may have a parallelepiped shape with a first pair of opposing major surfaces, a second pair of opposing side surfaces and a third pair of opposing end surfaces. In these embodiments, the at least one heat exchanger may preferably comprise a pair of heat exchangers coupled to the second pair of opposing side surfaces.

Charles M, Newton
Pike, randy tea
Richard A. Gasman

JP2002551905A

January 13, 2005

December 11, 2001

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Harris Corporation

F25D9/00; H01L23/34; H01L23/44; H01L23/473; B81B1/00; (IPC1-7): H01L23/44; B81B1/00; F25D9/00; H01L23/473

JP2000252671A

2000-09-14

WO2000017927A1

2000-03-30

Tadahiko Ito
Shinsuke Onuki
Tadashige Ito

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