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Title:
ELECTRONIC EQUIPMENT, ITS ENCLOSURE AND ELECTRONIC MODULE FOR THE SAME
Document Type and Number:
Japanese Patent JP2004246615
Kind Code:
A
Abstract:

To provide an electronic module of a liquid cooling type for enabling simple and safe attachment and detachment of a board at the time of extension and maintenance of the board in electronic equipment, the electronic equipment and its enclosure.

The electronic equipment stores a wiring board (an electronic module) 2 mounted with a CPU and the like 5 which is as a heating element, a liquid driving means 16 of refrigerant, a heat exchanger 15 for performing heat exchange with the refrigerant and a fan 18 and the like for blowing cooling air to the heat exchanger in the enclosure 100. In this electronic equipment, the wiring board (the electronic module) 2 is integrally provided with a cooling jacket 12 for forming a passage of the refrigerant inside and the electronic equipment 1 has a common wiring board 11 and a header 17 for loading the wiring board (the electronic module) 2 and the cooling jacket 12 which are integrally formed in a simultaneously attachable/detachable manner or is equipped with the cooling jacket beforehand, and in the case of loading the electronic module, the electronic module is integrally loaded with the cooling jacket.


Inventors:
OHASHI SHIGEO
SUZUKI ATSUSHI
KONDO YOSHIHIRO
MATSUSHITA SHINJI
YAMADA YASUNORI
MINAMITANI RINTARO
OSANAWA TAKASHI
NAKAGAWA TAKESHI
Application Number:
JP2003035502A
Publication Date:
September 02, 2004
Filing Date:
February 13, 2003
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G06F1/16; G06F1/20; H05K7/20; (IPC1-7): G06F1/20; G06F1/16; H05K7/20
Attorney, Agent or Firm:
Katsuo Ogawa
Kyosuke Tanaka
Takashi Sasaki