To solve the problem wherein resin used for a wiring layer at a solder ball side is limited in conventional electronic equipment and a method of manufacturing the conventional electronic equipment and hence the cost of electronic equipment cannot be reduced.
The electronic equipment 1 has first and second wiring layers 10, 20. On the lower surface of the wiring layer 10, the wiring layer 20 is formed. The wiring layer 10 has a via plug 12a (first conductive plug). The area of the end face at the side of the wiring layer 20 in the via plug 12a is larger than that of one at the opposite side. The via plug 12a is exposed onto a surface at the side of the wiring layer 20 in the wiring layer 10. The pyrolysis temperature of an insulating resin 14 for composing the wiring layer 10 is higher than that of an insulating resin 24 for composing the wiring layer 20.
| JP2020102587 | CIRCUIT COMPONENT |
| JP5443334 | Mounting board and its manufacturing method |
| JP6930793 | Module structure and module manufacturing method |
SOEJIMA KOJI
KAWANO MASAYA
| JP2005353837A | 2005-12-22 | |||
| JP2005063987A | 2005-03-10 | |||
| JP2003051569A | 2003-02-21 | |||
| JP2005340655A | 2005-12-08 | |||
| JP2001185653A | 2001-07-06 |