Title:
Conductive adhesives, anisotropic conductive films and electronic devices using them
Document Type and Number:
Japanese Patent JP6322190
Kind Code:
B2
Abstract:
Provided are a conductive adhesive and an anisotropic conductive film capable of suppressing deterioration by halogen at an adhesion portion, and using an epoxy (meth) acrylate resin, and further provided is an electronic device using such a conductive adhesive and an anisotropic conductive film. In a conductive adhesive and an anisotropic conductive film comprising conductive fillers and a binder resin, an epoxy (meth)acrylate resin contained in the binder resin is formed by adding a (meth) acrylic acid to an epoxy compound having the sum of total chlorine atom concentration and total bromine atom concentration of 300 mass ppm or less, and preferably 50 mass ppm or less, and the conductive fillers are dispersed in the binder resin containing the epoxy (meth)acrylate resin. The epoxy (meth) acrylate resin can be obtained by using raw material compound (substrate) having a carbon-carbon double bond, epoxidizing the carbon-carbon double bond preferably using hydrogen peroxide as an oxidant, and further adding a (meth)acrylic acid thereto.
More Like This:
Inventors:
Hiroyuki Uchida
Keitaka Ishibashi
Keitaka Ishibashi
Application Number:
JP2015510051A
Publication Date:
May 16, 2018
Filing Date:
March 27, 2014
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
C09J163/10; C09J4/00; C09J7/10; C09J9/02; C09J11/04; H01B1/00; H01B1/22; H01B5/16
Domestic Patent References:
| JP2012092247A | ||||
| JP58173118A | ||||
| JP2006274120A | ||||
| JP8176246A | ||||
| JP1171813A | ||||
| JP2000281914A | ||||
| JP2010235649A | ||||
| JP2000169821A |
Attorney, Agent or Firm:
Motoji Aihara
Previous Patent: A microRNA compound and a method for adjusting MIR-21 activity
Next Patent: JPS6322191
Next Patent: JPS6322191