Title:
ELECTRONIC PART DEVICE
Document Type and Number:
Japanese Patent JP3723461
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic part device which can be repaired even when it has defects in electric connection after once underfilled.
SOLUTION: In this electronic part device, a semiconductor element (a flip chip) 1 is mounted on a circuit board 2 in such a manner that connecting electrodes (solder bumps) 3 installed on the semiconductor element 1 and connecting electrodes (solder pads) 5 installed on the circuit board 2 are facing each other. The gap between the circuit board 2 and the semiconductor element 1 is sealed with a sealing resin layer 4 formed from a liquid epoxy resin composition essentially comprising (A) a liquid epoxy resin, (B) at least either a fluorine-containing aromatic diamine or its derivative, and (C) an inorganic filler.
Inventors:
Koji Matsui
Ichiro Masuyama
Masahiro Kubo
Kazumasa Igarashi
Ichiro Masuyama
Masahiro Kubo
Kazumasa Igarashi
Application Number:
JP2001053050A
Publication Date:
December 07, 2005
Filing Date:
February 27, 2001
Export Citation:
Assignee:
NEC
NITTO DENKO CORPORATION
NITTO DENKO CORPORATION
International Classes:
C09K3/10; C08G59/50; C08K3/00; C08L63/00; H01L21/60; H01L23/29; H01L23/31; (IPC1-7): C08G59/50; C08K3/00; C08L63/00; C09K3/10; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2002060594A | ||||
| JP5341149A | ||||
| JP2282353A |
Attorney, Agent or Firm:
Masahiko Nishito
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