Title:
ELECTRONIC PART PACKAGING DEVICE AND SOLDERING METHOD
Document Type and Number:
Japanese Patent JPH08279529
Kind Code:
A
Abstract:
PURPOSE: To provide the title electronic packaging device capable of previously preventing the burning of a printed board or a solder ball production due to any foreign matters.
CONSTITUTION: The title electronic part packaging device solder-connecting a lead Ta provided on a TCP part to a pad Pa previously solder coated on a printed board P is provided with a laser beam irradiating device 20 irradiating the pad Pa with laser beams L, a gas spraying device 30 spraying nitrogen gas over the pad Pa before it is irradiated with laser beams.
More Like This:
Inventors:
FUKATSU KENTA
Application Number:
JP8052995A
Publication Date:
October 22, 1996
Filing Date:
April 05, 1995
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L21/60; H05K3/34; (IPC1-7): H01L21/60; H01L21/60
Attorney, Agent or Firm:
鈴江 武彦