Title:
ELECTRONIC PARTS HANDLING DEVICE, HANDLING METHOD AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3171072
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To perform handling such as conveyance and alignment 10 a gentle state to electronic parts so as not to generate mechanical damage to the electronic parts.
SOLUTION: A chamber 25 is provided below a perforated plate 22 with a large number of pores formed and with its upper face 28 inclined at a tilt angle 29 to a horizontal plane, and compressed air is led into the chamber 25 through a conduit 27 so as to discharge this compressed air to the upper face 28 side of the perforated plate 22. Electronic parts 31 positioned on the upper face 28 side of the perforated plate 22 are thereby placed in a state of floating from the perforated plate 22 and moved in accordance with the inclination of the upper face 28. The moved electronic parts 31 are received one by one into pockets 32 formed at a stopper wall 30 rotated around.
Inventors:
Kurome Hideo
Kota Tamura
Kenichi Watanabe
Kota Tamura
Kenichi Watanabe
Application Number:
JP29505495A
Publication Date:
May 28, 2001
Filing Date:
November 14, 1995
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
B65G29/00; B65G47/14; B65G51/03; H01G13/00; H05K13/02; (IPC1-7): B65G51/03; B65G29/00
Domestic Patent References:
| JP51151973A | ||||
| JP69052A | ||||
| JP3115012A | ||||
| JP63290388A | ||||
| JP514034U | ||||
| JP5856715U |
Attorney, Agent or Firm:
Masaaki Koshiba