Title:
Electronic parts and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6156345
Kind Code:
B2
Abstract:
In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.
Inventors:
Yoshifumi Masaki
Hirotsugu Tomioka
Shinichiro Izumi
Eiji Iso
Hirotsugu Tomioka
Shinichiro Izumi
Eiji Iso
Application Number:
JP2014249622A
Publication Date:
July 05, 2017
Filing Date:
December 10, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01F27/29; H01F17/00; H01F41/10; H01G4/12; H01G4/232; H01G4/252; H01G4/30
Domestic Patent References:
| JP684687A | ||||
| JP201486718A | ||||
| JP2002359103A | ||||
| JP201358558A | ||||
| JP2014187058A | ||||
| JP63115206U | ||||
| JP200512167A | ||||
| JP8124761A | ||||
| JP201417314A | ||||
| JP2015204451A | ||||
| JP200649753A | ||||
| JP2011165725A |
Attorney, Agent or Firm:
Samejima Mutsumi
Yoshida Tamaki
Yoshida Tamaki
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