Title:
ELECTRONIC PARTS MOUNTING STRUCTURE
Document Type and Number:
Japanese Patent JPS5321771
Kind Code:
A
Abstract:
A flipchip LSI is mounted on a glass substrate through the use of bonding techniques. An insulating layer made of, for example, epoxy resin is formed between the LSI chip and the glass substrate in such a manner that the insulating layer is fixed to both of the LSI chip and the glass substrate. The insulating layer functions to absorb strain caused by differences of the coefficient of thermal expansion of the LSI chip and the glass substrate, thereby securing stable operation of the LSI chip.
Inventors:
INOUE YUKIHIRO
Application Number:
JP9636576A
Publication Date:
February 28, 1978
Filing Date:
August 11, 1976
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L21/52; H01L21/56; H05K1/18; H01L23/15; (IPC1-7): H01L21/58; H05K3/30
Domestic Patent References:
| JPS4931747A | 1974-03-22 |