PURPOSE: To provide excellent thermal conductivity and electric conductivity of a lead, to provide sufficiently high hardness and to avoid the change in hardness even though heat history is received, by forming the lead material of an electronic part, in which semiconductor pellet is sealed, by copper alloy wire including chromium.
CONSTITUTION: In a glass molded diode, a silicon pellet 1 having a P-N junction is held and fixed to an electrode 2 made of molybdenum or tungsten through aluminum solder 3. A copper alloy lead 4 is welded to the electrode 2. The pellet 1 is sealed by a glass 5. The lead 4 is constituted by the copper alloy comprising 0.5W1.5wt% chromium and copper for the remaining part. When the chromium is less than 0.5wt%, the required hardness is not obtained when a heat history is received and annealing is performed. When the chromium is more than 1.5wt%, the electric conductivity and the thermal conductivity become lower than those of copper. Therefore the part is not practical.
SHIMA KENZOU
HIDAKA TOSHIYUKI
TOIDA HIROTOSHI
HITACHI HARAMACHI DENSHI KOGYO
| JPS58141544A | 1983-08-22 |