Title:
電子機器
Document Type and Number:
Japanese Patent JP4609504
Kind Code:
B2
Abstract:
An electronic unit includes a first circuit board having a power semiconductor device and an electrolytic capacitor and a second circuit board having an electronic component to control the power semiconductor device. The second circuit board is arranged perpendicular to the first circuit board and along the surface of the electrolytic capacitor. The electronic unit further includes a connecting member being jointed at one end thereof to the first circuit board and jointed at the other end thereof to the second circuit board for electrical connection between the first and second circuit boards.
More Like This:
| JP2015060923 | ELECTRONIC MODULE |
| JP2005268552 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| JP2016131245 | MULTILAYER SUBSTRATE |
Inventors:
Hiroyuki Onishi
Toshiaki Nagase
Jun Ishikawa
Naoto Kanie
Konya Kazuyoshi
Toshiaki Nagase
Jun Ishikawa
Naoto Kanie
Konya Kazuyoshi
Application Number:
JP2008054046A
Publication Date:
January 12, 2011
Filing Date:
March 04, 2008
Export Citation:
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
International Classes:
H01L25/18; H01L25/07; H02M7/48
Domestic Patent References:
| JP2005328015A | ||||
| JP2003110090A | ||||
| JP9308265A | ||||
| JP6125151A | ||||
| JP5001832A | ||||
| JP10270609A | ||||
| JP2003110089A | ||||
| JP2004006905A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda