Title:
電子機器
Document Type and Number:
Japanese Patent JP4676008
Kind Code:
B2
Abstract:
An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.
Inventors:
Takeshi Hongo
Application Number:
JP2009082340A
Publication Date:
April 27, 2011
Filing Date:
March 30, 2009
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G06F1/20; F28D15/02; H01L23/36; H01L23/40; H01L23/427; H05K7/20
Domestic Patent References:
| JP6304066A | ||||
| JP2000106495A | ||||
| JP2007323160A | ||||
| JP2007142294A | ||||
| JP2006324470A |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
Hiroshi Horiguchi
Hiroshi Horiguchi